We use a variety of lasers for the microprocessing of components.
These include marking lasers for labelling and ultra-short pulse lasers for cutting and burr-free removal of material. The ultrashort pulse laser technology ionizes the material directly without generating an undesired heat influence on your component.
To be able to create high-precision structures on round parts, we also have laser systems with up to 4 controlled axes.
![](https://www.geiger-gmbh.de/cm19/wp-content/uploads/2020/04/Micro-processing-250x250.jpg)
![](https://www.geiger-gmbh.de/cm19/wp-content/uploads/2020/04/Micro-processing_2-250x250.jpg)